The molecular structure of the epoxy resin is a molecular chain containing reactive epoxy groups characterized by the epoxy group at the ends of the molecular chain or a cyclic structure in the middle. It to the surface of metals and non-metallic materials, has excellent adhesion strength, good dielectric properties, given variable shrinkage, good dimensional stability, high hardness, good flexibility, and most of the solvent stable to alkali, which is widely used in various sectors of national defense, economy, for pouring, dipping, laminating materials, adhesives, coatings and other uses.